QEB373 Ver la hoja de datos (PDF) - Fairchild Semiconductor

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componentes Descripción

Fabricante

QEB373

Subminiature Plastic Infrared Emitting Diode

Fairchild Semiconductor 

Surface Mount Options for T-3/4 Package

Features

■ Three lead forming options: Gull Wing, Yoke and Z-Bend

■ Compatible with automatic placement equipment

■ Supplied on tape and reel or in bulk packaging

■ Compatible with vapor phase reflow solder processes

Gull Wing Lead Configuration

0.166 (4.2)

0.020 (0.51)

0.074 (1.9)

.118 (3.0) 0.078 (2.0)

.102 (2.6)

0.043 (1.1)

0.106 (2.7)

0.091 (2.3)

0.016 (0.4)

CATHODE

0.087 (2.2)

0.071 (1.8)

0.024 (0.6)

0.055 (1.4)

0.005 (0.13)

Yoke Lead Configuration

0.098 (2.5)

0.283 (7.2)

0.020 (0.5)

0.074 (1.9)

CATHODE

0.087 (2.2)

0.071 (1.8)

0.016 (0.4)

0.118 (3.0)

0.102 (2.6)

0.031 (0.8)

0.051 (1.3)

0.043 (1.1)

0.141 (3.6)

0.055 (1.4)

0.008 (0.2)

Z-Bend Lead Configuration

0.236 (6.0)

0.220 (5.6)

0.127 (3.25)

0.112 (2.85)

0.177 (4.5)

0.161 (4.1)

0.020 (0.5)

0.074 (1.9)

CATHODE

0.087 (2.2)

0.071 (1.8)

0.016 (0.4)

.118 (3.0) 0.080 (2.0)

.102 (2.6)

0.024 (0.6)

0.031 (0.8) 0.055 (1.4)

0.043 (1.1)

0.106 (2.7)

0.091 (2.3)

Notes: (Applies to all package drawings)

1. Dimensions are in inches (mm).

2. Tolerance of ±.010 (.25) on all non nominal dimensions unless otherwise specified.

©2009 Fairchild Semiconductor Corporation

QEB373 Rev. 1.0.1

4

www.fairchildsemi.com

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