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LSD20463

SmartHCF™ Mobile Modem

Conexant Systems 

SmartHCF Mobile Modem Designer’s Guide

2.9 DIAGNOSTICS......................................................................................................................................... 2-4

2.9.1 Commanded Tests..................................................................................................................... 2-4

2.10 LOW POWER SLEEP MODE................................................................................................................... 2-4

3. HARDWARE INTERFACE ................................................................................................................................. 3-1

3.1 HSD (P9573) HARDWARE PINS AND SIGNALS .................................................................................... 3-1

3.1.1 HSD Signal Interfaces................................................................................................................ 3-1

PCI Bus/MiniPCI/CardBus Host Interface ......................................................................... 3-1

Power Detection and Switching ........................................................................................ 3-1

Serial EEPROM Interface ................................................................................................. 3-1

LSD Interface (Through DIB) ............................................................................................ 3-2

VC Interface (S Models).................................................................................................... 3-2

Telephone Handset Interface (S Models) ......................................................................... 3-2

Call Progress Speaker Interface ....................................................................................... 3-2

3.1.2 HSD Interface Signals, Pin Assignments, and Signal Definitions .............................................. 3-2

3.2 LSD (20463) HARDWARE PINS AND SIGNALS................................................................................... 3-11

3.2.1 LSD Signal Interfaces .............................................................................................................. 3-11

HSD Interface (Through DIB).......................................................................................... 3-11

Telephone Line Interface ................................................................................................ 3-11

3.2.2 LSD Interface Signals, Pin Assignments, and Signal Definitions............................................. 3-11

3.3 VC (20437) HARDWARE PINS AND SIGNALS (S MODELS) ............................................................... 3-16

3.3.1 VC Signal Interfaces ................................................................................................................ 3-16

Speakerphone Interface.................................................................................................. 3-16

Telephone Handset/Headset Interface ........................................................................... 3-16

HSD Interface.................................................................................................................. 3-16

3.3.2 VC Interface Signals, Pin Assignments, and Signal Definitions............................................... 3-16

3.4 ELECTRICAL, ENVIRONMENTAL, AND TIMING SPECIFICATIONS................................................... 3-22

3.4.1 Operating Conditions and Absolute Maximum Ratings............................................................ 3-22

Caution: Handling CMOS Devices .................................................................................. 3-22

3.4.2 PCI BUS ELECTRICAL, SWITCHING, AND TIMING CHARACTERISTICS............................ 3-22

3.4.3 SERIAL EEPROM INTERFACE TIMING ................................................................................. 3-23

4. CRYSTAL SPECIFICATIONS .......................................................................................................................... 4-25

5. LAYOUT GUIDELINES....................................................................................................................................... 5-1

5.1 EMI CONSIDERATIONS .......................................................................................................................... 5-1

5.1.1 General ...................................................................................................................................... 5-1

5.1.2 Filtering ...................................................................................................................................... 5-1

5.1.3 Decoupling ................................................................................................................................. 5-2

5.1.4 Optional Configurations ............................................................................................................. 5-2

5.2 GENERAL LAYOUT GUIDELINES FOR A 2-LAYER PCI BOARD .......................................................... 5-3

5.2.1 Placing Components .................................................................................................................. 5-3

5.2.2 Power ......................................................................................................................................... 5-4

5.2.3 Grounds ..................................................................................................................................... 5-4

5.2.4 Trace Widths .............................................................................................................................. 5-4

5.2.5 Trace Spacing............................................................................................................................ 5-4

5.2.6 Trace Routing ............................................................................................................................ 5-5

5.3 SPECIFIC LAYOUT GUIDELINES FOR A 6-LAYER MINI PCI BOARD .................................................. 5-6

5.3.1 Digital Section ............................................................................................................................ 5-6

Crystal Circuit.................................................................................................................... 5-6

DIB Interface ..................................................................................................................... 5-6

MiniPCI Signal Routing ..................................................................................................... 5-6

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