TE28F400B3T110 Ver la hoja de datos (PDF) - Intel

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TE28F400B3T110

SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

Intel 

E

SMART 3 ADVANCED BOOT BLOCK

1

2

3

4

5

6

7

8

16M

A

A13

A11

A8

VPP

WP#

A19

A7

A4

8M

B

A14

A10

WE# RP#

A18

A17

A5

A2

C

A15

A12

A9

32M

A20

A6

A3

A1

D

A16

D14

D5

D11

D2

D8

CE#

A0

E

VCCQ

D15

D6

D12

D3

D9

D0

GND

F GND

D7

D13

D4

VCC

D10

D1

OE#

0580_03

NOTES:

1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address

solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the

upgrade address for the 32-Mbit device.

2. 4-Mbit density not available in µBGA* CSP.

Figure 4. x16 48-Ball µBGA* Chip Size Package (Top View, Ball Down)

PRELIMINARY

9

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