TE28F400B3T110 Ver la hoja de datos (PDF) - Intel

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TE28F400B3T110

SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

Intel 

SMART 3 ADVANCED BOOT BLOCK

E

1

2

3

4

5

6

7

8

16M

A

A14

A12

A8

VPP

WP#

A20

A7

A4

8M

B

A15

A10

WE# RP#

A19

A18

A5

A2

C

A16

A13

A9

32M

A21

A6

A3

A1

D

A17

NC

D5

NC

D2

NC

CE#

A0

E

VCCQ

A11

D6

NC

D3

NC

D0

GND

F GND

D7

NC

D4

VCC

NC

D1

OE#

0580_04

NOTE:

1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address

solder balls. Routing is not recommended in this area. A20 is the upgrade address for the 16-Mbit device. A21 is the

upgrade address for the 32-Mbit device.

2. 4-Mbit density not available in µBGA* CSP.

Figure 3. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)

8

PRELIMINARY

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