TE28F400B3T110 Ver la hoja de datos (PDF) - Intel
Número de pieza
componentes Descripción
Fabricante
TE28F400B3T110 Datasheet PDF : 48 Pages
| |||
E
SMART 3 ADVANCED BOOT BLOCK
A16
A15
A14
A13
A12
A11
A9
A8
WE#
RP#
VPP
WP#
A18
A7
A6
A5
A4
A3
A2
A1
1
40
A17
2
39
GND
3
38
A20
16 M
4
5
37
36
A19
A10
8M
6
35
DQ7
7
34
DQ6
8
Advanced Boot Block
33
DQ5
9
40-Lead TSOP
32
DQ4
10
10 mm x 20 mm
31
VCCQ
11
30
VCC
12
13
TOP VIEW
29
NC
28
DQ3
14
27
DQ2
15
26
DQ1
16
25
DQ0
17
24
OE#
18
23
GND
19
22
CE#
20
21
A0
NOTES:
1. 40-Lead TSOP available for 8- and 16-Mbit densities only.
2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pin 38.
0580_01
Figure 1. 40-Lead TSOP Package for x8 Configurations
A15
1
A14
2
A13
3
A12
4
A11
5
A10
6
A9
7
A8
8
NC
9
32 M
A20
10
WE#
11
RP#
12
VPP
13
WP#
14
16 M
8M
4M
A19
A18
A17
15
16
17
A7
18
A6
19
A5
20
A4
21
A3
22
A2
23
A1
24
Advanced Boot Block
48-Lead TSOP
12 mm x 20 mm
TOP VIEW
48
A16
47
VCCQ
46
GND
45
DQ15
44
DQ7
43
DQ14
42
DQ6
41
DQ13
40
DQ5
39
DQ12
38
DQ4
37
VCC
36
DQ11
35
DQ3
34
DQ10
33
DQ2
32
DQ9
31
DQ1
30
DQ8
29
DQ0
28
OE#
27
GND
26
CE#
25
A0
NOTE:
Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pins 9 and 15.
0580_02
Figure 2. 48-Lead TSOP Package for x16 Configurations
PRELIMINARY
7
Share Link: 