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TE28F400B3T110

SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

Intel 

E

PRELIMINARY

SMART 3 ADVANCED BOOT BLOCK

4-, 8-, 16-, 32-MBIT

FLASH MEMORY FAMILY

28F400B3, 28F800B3, 28F160B3, 28F320B3

28F008B3, 28F016B3, 28F032B3

n Flexible SmartVoltage Technology

 2.7 V–3.6 V Read/Program/Erase

 12 V VPP Fast Production

Programming

n 2.7 V or 1.65 V I/O Option

 Reduces Overall System Power

n High Performance

 2.7 V–3.6 V: 90 ns Max Access Time

 3.0 V–3.6 V: 80 ns Max Access Time

n Optimized Block Sizes

 Eight 8-KB Blocks for Data,

Top or Bottom Locations

 Up to Sixty-Three 64-KB Blocks for

Code

n Block Locking

 VCC-Level Control through WP#

n Low Power Consumption

 10 mA Typical Read Current

n Absolute Hardware-Protection

 VPP = GND Option

 VCC Lockout Voltage

n Extended Temperature Operation

 –40 °C to +85 °C

n Flash Data Integrator Software

 Flash Memory Manager

 System Interrupt Manager

 Supports Parameter Storage,

Streaming Data (e.g., Voice)

n Automated Program and Block Erase

 Status Registers

n Extended Cycling Capability

 Minimum 100,000 Block Erase

Cycles Guaranteed

n Automatic Power Savings Feature

 Typical ICCS after Bus Inactivity

n Standard Surface Mount Packaging

 48-Ball µBGA* Package

 48-Lead TSOP Package

 40-Lead TSOP Package

n Footprint Upgradeable

 Upgrade Path for 4-, 8-, 16-, and 32-

Mbit Densities

n ETOX™ VI (0.25 µ) Flash Technology

The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-

rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability

(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been

added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and

interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single

device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,

monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-

lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be

obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.

July 1998

Order Number: 290580-005

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