T405Q-600 Ver la hoja de datos (PDF) - STMicroelectronics
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T405Q-600 Datasheet PDF : 12 Pages
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T405Q-600
Characteristics
Figure 7. Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
Figure 8. Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
3.0
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
2.5
1.6
1.4
2.0
1.2
IGT
1.5
1.0
0.8
1.0
IH & IL
0.6
0.5
Tj(°C)
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
0.4
0.2
0.0
0.1
(dV/dt)c (V/µs)
1.0
10.0
Figure 9. Relative variation of critical rate of
decrease of main current versus junction
temperature
Figure 10. Relative variation of static dV/dt
immunity versus junction temperature
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
8
7
6
5
4
3
2
1
Tj(°C)
0
25
50
75
100
dV/dt [Tj] / dV/dt [Tj = 125°C]
8
7
6
5
4
3
2
1
0
125
25
Tj(°C)
50
75
VD=VR=400V
100
125
Figure 11. DPAK thermal resistance junction to ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm)
Rth(j-a)(°C/W)
100
90
80
70
60
50
40
30
20
10
0
0
2
4
6
S(cm²)
8
10 12 14 16 18 20
DocID10368 Rev 4
5/12
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