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Número de pieza
componentes Descripción
TZA3030U Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
TZA3030U
SDH/SONET STM1/OC3 optical receiver
Philips Electronics
TZA3030U Datasheet PDF : 20 Pages
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Philips Semiconductors
SDH/SONET STM1/OC3 optical receiver
Objective specification
TZA3030
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
SYMBOL
AGND
V
CCA
AGND
DREF
V
CCA
AGND
IPhoto
AGND
AGND
BWC
V
ref
SUB
DGND
RFTEST
OUTSEL
DGND
V
CCD
OUTCML
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
COORDINATES
(1)
x
102
102
102
102
102
102
102
102
243
383
523
663
803
943
1 100
1 257
1 398
1 398
y
1 251
1 111
971
814
674
534
395
254
105
105
105
105
105
105
105
105
263
403
SYMBOL
PAD
COORDINATES
(1)
x
y
OUTQCML
V
CCD
DGND
OUTPECL
OUTQPECL
DGND
DGND
LOS
LOSQ
LOSTTL
LOSTH
AGND
AGC
AGND
19
1 398
20
1 398
21
1 398
22
1 398
23
1 398
24
1 398
25
1 283
26
1 143
27
986
28
829
29
671
30
514
31
357
32
217
543
683
823
963
1 103
1 243
1 400
1 400
1 400
1 400
1 400
1 400
1 400
1 400
Note
1. All coordinates (
µ
m) are measured with respect to the
bottom left-hand corner of the die.
handbook, full pagewidth
1998 Aug 24
AGND
VCCA
AGND
1.58
DREF
mm
VCCA
AGND
IPhoto
AGND
32 31 30 29 28 27 26 25
1
24
2
23
3
22
4
TZA3030U
21
5
20
6
19
7
18
8
17
9 10 11 12 13 14 15 16
DGND
OUTQPECL
OUTPECL
DGND
VCCD
OUTQCML
OUTCML
VCCD
x
0
0
y
1.58 mm
MBK858
Fig.3 Bonding pad locations of TZA3030U.
6
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