TN805-400B Ver la hoja de datos (PDF) - STMicroelectronics
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TN805-400B Datasheet PDF : 5 Pages
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Fig. 1: Maximum average power dissipation ver-
sus average on-state current .
TN805/815-B
Fig. 2 : Correlation between maximum average
power dissipation and maximum allowable tem-
peratures (Tamb and Tcase) for different thermal
resistances heatsink+contact.
P(W)
8
7
6
5
4
3
2
1
0
0
1
α = 180°
α = 120°
α = 90°
D.C.
α = 60°
α = 30°
360°
IT(av)(A)
α
2
3
4
5
6
7
P(W)
Tcase (°C)
8
7 α = 180°
6
5
Rth=0°C/W
105
110
4
Rth=37°C/W
3
115
2
120
1
Tamb(°C)
0
125
0 10 20 30 40 50 60 70 80 90 100 110 120 130
Fig. 3-1: Average and D.C. on-state current versus
case temperature.
Fig. 3-2: Average and D.C. on-state current versus
case temperature.
IT(av)(A)
10
D.C.
8
6
α = 180°
4
2
Tcase(°C)
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130
IT(av)(A)
2.0
1.8
1.6
D.C.
1.4
1.2
α = 180°
1.0
0.8
0.6
0.4
0.2
Tamb(°C)
0.0
0 10 20 30 40 50 60 70 80 90 100 110 120 130
Fig. 4-1: Relative variation of thermal impedance Fig. 4-2: Relative variation of thermal impedance
versus pulse duration.
versus pulse duration.
K=[Zth(j-c)/Rth(j-c)]
1.0
0.5
0.2
0.1
1E-3
1E-2
tp(s)
1E-1
K=[Zth(j-a)/Rth(j-a)]
1.00
0.10
1E+0
0.01
1E-2
1E-1
tp(s)
1E+0
1E+1
1E+2 5E+2
3/5
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