HCTS11MS Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
HCTS11MS Datasheet PDF : 7 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
DIE ATTACH:
Material: Silver Epoxy
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS11MS
HCTS11MS
A1
VCC
C1
(1)
(14)
(13)
B1 (2)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
Y2
GND
Y3
7-146
(12) Y1
(11) C3
(10) B3
(9) A3
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