HCTS02D Ver la hoja de datos (PDF) - Intersil

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componentes Descripción

Fabricante

HCTS02D

Radiation Hardened Quad 2-Input NOR Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20mm x 2.24mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

A1 (2)

HCTS02MS

HCTS02MS

Y1

VCC

Y4

(1)

(14)

(13)

B1 (3)

Y2 (4)

A2 (5)

(6)

(7)

(8)

B2

GND

A3

(12) B4

(11) A4

(10) Y3

(9) B3

Spec Number 518841

8

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