HCTS4002D/SAMPLE Ver la hoja de datos (PDF) - Intersil

Número de pieza

componentes Descripción

Fabricante

HCTS4002D/SAMPLE

Radiation Hardened Dual 4-Input NOR Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20mm x 2.24mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS4002MS

HCTS4002MS

A1 (2)

B1 (3)

C1 (4)

D1 (5)

(12) D2

(11) C2

(10) B2

(9) A2

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS4002 is TA14429A.

Spec Number 518632

725

Share Link: