HA-4741/883 Ver la hoja de datos (PDF) - Intersil

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HA-4741/883

HA-4741/883

Intersil 

HA-4741/883

Die Characteristics

DIE DIMENSIONS:

87 x 75 x 19 mils ± 1 mils

2210 x 1910 x 483µm ± 25.4µm

METALLIZATION:

Type: Al, 1% Cu

Thickness: 16kÅ ± 2kÅ

GLASSIVATION:

Type: Nitride

Thickness: 7kÅ ± 0.7kÅ

WORST CASE CURRENT DENSITY:

1.68 x 105 A/cm2

SUBSTRATE POTENTIAL (Powered Up): V-

TRANSISTOR COUNT: 72

PROCESS: Junction Isolated Bipolar/JFET

Metallization Mask Layout

HA-4741/883

-IN4

+IN4 V- +IN3

-IN3

OUT4

OUT1

OUT3

OUT2

-IN1

+IN1 V+ +IN2

-IN2

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

Spec Number 511007-883

5

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