H11AG1M Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
H11AG1M Datasheet PDF : 10 Pages
| |||
Tape Dimensions
4.5 ± 0.20
0.30 ± 0.05
12.0 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
21.0 ± 0.1
Ø1.5 MIN
1.75 ± 0.10
11.5 ± 1.0
9.1 ± 0.20
24.0 ± 0.3
0.1 MAX
10.1 ± 0.20
User Direction of Feed
Note:
All dimensions are in inches (millimeters)
Ø1.5 ± 0.1/-0
Reflow Soldering Profile
300
280
260
240
220
200
180
160
°C 140
120
100
80
60
40
20
0
0
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
1.822°C/Sec Ramp up rate
33 Sec
60
120
180
Time (s)
270
360
©2007 Fairchild Semiconductor Corporation
H11AG1M Rev. 1.0.3
9
www.fairchildsemi.com
Share Link: 