MMBZ5250B-TP Ver la hoja de datos (PDF) - Micro Commercial Components
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MMBZ5250B-TP Datasheet PDF : 5 Pages
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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Features
• Halogen free available upon request by adding suffix "-HF"
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Wide Voltage Range Available
• Small Outline Package For Space Savings
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Surface Mount Package
Maximum Ratings
• Operating Junction Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 357°C/W Junction To Ambient
MMBZ5221B
THRU
MMBZ5259B
350 mW
Zener Diode
2.4 to 39 Volts
SOT-23
A
D
Maximum Ratings @ 25oC Unless Otherwise Specified
Zener Current
IF
Maximum Forward VF
Voltage
Power Dissipation
Pd
(No te s A)
Pe ak Forward S urge IFSM
Current (Not e s B)
100
mA
1. 2
V
350 mWatt
4.0
Amps
NOTES:
A. Mounted on FR4 PC board with our suggested solder pad layout .
B. Measured on 8.3ms, single half sine-wave or equivalent
square wave, duty cycle = 4 pulses per minute maximum.
*Pin Configuration - Top View
CB
E
F
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.119
B
.086
.103
C
.047
.056
D
.033
.041
E
.066
.083
F
---
.006
G
.035
.044
H
.002
.006
J
.013
.020
K
.007
---
MM
MIN
2.80
2.20
1.20
.85
1.70
---
.90
.05
.35
.20
MAX
3.00
2.60
1.40
1.05
2.10
.15
1.10
.15
.50
---
Suggested Solder
Pad Layout
.035
.900
NOTE
.055
1.40
.102
2.60
inches
mm
.035
.880
.035
.880
Revision: B
www.mccsemi.com
1 of 5
2013/01/01
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