RMBA19500-58 Ver la hoja de datos (PDF) - Raytheon Company
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RMBA19500-58 Datasheet PDF : 4 Pages
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RMBA19500-58 - PCS 2 Watt Linear GaAs
RF Components MMIC Power Amplifier
PRODUCT INFORMATION
Test Procedure
for the evaluation board
(RMBA19500-58-TB)
Parts List
or Test Evaluation Board
(RMBA19500-58-TB,
G6655971)
CAUTION: LOSS OF GATE VOLTAGES (VG1, VG2, VG3) WHILE CORRESPONDING DRAIN
VOLTAGES (Vdd) ARE PRESENT CAN DAMAGE THE AMPLIFIER.
The following sequence must be followed to properly test the amplifier. (It is necessary to add a fan to
provide air cooling across the heat sink of RMBA19500.)
Step 1: Turn off RF input power.
Step 2: Use GND terminal of the evaluation board
for the ground of the DC supplies. Set
Vgg1, Vgg2 and Vgg3 to -3V (pinch-off).
Step 3: Slowly apply drain supply voltages of +7 V
to the board terminal Vdd ensuring that
there is no short.
Step 4: Adjust Vgg12 down from -3V until the
drain current (with no RF applied)
increases to Idq12 as per supplied result
sheet. Then adjust Vgg3 until the total
drain current becomes equal to the sum of
Idq12 and Idq3.
Step 5: After the bias condition is established, RF
input signal may now be applied at the
appropriate frequency band and
appropriate power level.
Step 6: Follow turn-off sequence of:
(i) Turn off RF Input Power
(ii) Turn down and off drain voltage Vdd.
(iii) Turn down and off gate voltages Vgg1,
Vgg2 and Vgg3.
Part
Value
L1, L2,L4
5.6 nH
L3
10 nH
C1
10 pF
C9
2.2 pF
C3, C4, C5 1500 pF
C10
2.0 pF
C2
15.0 pF
C8,C11,C14,C15 4.7 uF
C6,C7
0.1 uF
R1,R5
20 Ohms
R2,R7
1000 Ohms
R3
910 Ohms
R4
30 Ohms
R6
1.1K Ohms
R8
390 Ohms
R9
300 Ohms
U1
RMBA19500-58
HS
Heatsink
P1
Terminals
J1, J2
SMA Connectors
Board FR4
Size (EIA)
.06” x .03”
.085” x .060”
.067” x .036”
.042” x .022”
.067” x .036”
.042” x .022”
.134” x .071”
.183” x .054”
.069” x .037”
.069” x .037”
.069” x .037”
.069” x .037”
.069” x .037”
.31” x .41”
Vendor(s)
Toko (LL1608-F5N6)
Coilcraft (0805HT-10NTKBC)
Murata(GRM39COG100J050AD)
Murata(GRM36COG2R2J050BD)
Murata (GRM39Y5V152Z50V)
Murata(GRM36COG2R20J050BD)
Murata(GRM36COG150J050)
TDK (C3216XR1A475KT)
Murata (GRM39Y5V104Z50)
IMS (RCI-0603-20R0J)
IMS (RCI-0603-1001J)
IMS (RCI-0603-9100J)
IMS (RCI-0603-30R0J)
IMS (RCI-0603-1101J)
IMS (RCI-0603-3900J)
IMS (RCI-0603-3000J)
Raytheon
Raytheon, G655548
3M (2340-5211TN)
E.F. Johnson (142-0701-841)
Raytheon Dwg#
G654187/G654941
Thermal
Considerations
for Heat Sinking the
RMBA19500-58
The PWB must be prepared with either an embedded copper slug in the board where the package is to
be mounted or a heat sink should be attached to the backside of the PWB where the package is to be
mounted on the front side. The slug or the heat sink should be made of a highly electrically and
thermally conductive material such as copper or aluminum. The slug should be at least the same
thickness as the PWB. In the case of the heat sink, a small pedestal should protrude through a hole in
the PWB where the package bottom is directly soldered. In either configuration, the top surface of the
slug or the pedestal should be made coplanar with the package lead mounting plane i.e., the top
surface of the PWB. Use Sn96 solder (96.5% Sn and 3.5% Ag) at 220ºC for 20 seconds or less to
attach the heat sink to the backside of the PWB. Then, using Sn63, the package bottom should be
firmly soldered to the slug or the pedestal while the pins are soldered to the respective pads on the front
side of the PWB without causing any stress on the pins. Remove flux completely if used for soldering.
www.raytheonrf.com
Specifications are based on most current or latest revision.
Revised June 27, 2003
Page 4
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
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