PACDN010Q Ver la hoja de datos (PDF) - California Micro Devices => Onsemi
Número de pieza
componentes Descripción
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PACDN010Q Datasheet PDF : 4 Pages
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CALIFORNIA MICRO DEVICES
TSSOP - TOP VIEW
H
CAMD
EH
1
PACDN010
Power Derating Curve
D
e
B
MECHANICAL SPECIFICATIONS
Lead Plating
Tin-Lead
Lead Material
Copper Alloy
Lead Coplanarity
0.004" (0.102mm)
Substrate Material
Silicon
Body Material
Molded Epoxy
Flammabiltiy
UL94V-0
C
L
A
A1
Package Dimensions, Power Dissipation & Information
Package
TSSOP
Pins
24
JEDEC
MO153
mm
inches
min
max
min
max
A
-
1.10
-
0.433
A1
0.05
0.15
0.002
0.006
B
0.19
0.30
0.0075
0.0118
C
0.09
0.20
0.0035
0.0079
D
7.70
7.90
0.303
0.311
E
4.30
4.50
0.169
0.177
e
0.65 BSC
0.0256 BSC
H
6.25
6.50
0.246
0.256
L
0.50
0.70
0.020
0.028
PD @ 70°C
# / tube
1.00W
62 pcs
# / tape & reel
2,500 pcs
© 2000 California Micro Devices Corp. All rights reserved.
4/00
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
4
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