Maxim Integrated
PACKAGE OUTLINE, 8L, 14L,16L, SOIC .150 INCH
Maxim Integrated
PACKAGE OUTLINE, 9 BUMPS, 3x3 ARRAY, UCSP(B)PKG.
Maxim Integrated
PACKAGE OUTLINE, PDIP.300
Maxim Integrated
PACKAGE OUTLINE, 10L UMAX/USOP
Dallas Semiconductor -> Maxim Integrated
PACKAGE OUTLINE, 2x2 UCSP
Maxim Integrated
PACKAGE OUTLINE, 6L UDFN, 1.5 X 1.0 X 0.8mm
Maxim Integrated
I2C Serial Real-Time Clock
Maxim Integrated
I2C Serial Real-Time Clock
Maxim Integrated
PACKAGE OUTLNE, SOT 6L BODY
Dallas Semiconductor -> Maxim Integrated
PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
Maxim Integrated
I2C Serial Real-Time Clock
Maxim Integrated
PACKAGEOUTLINE
