SMDB05V Ver la hoja de datos (PDF) - SEOUL SEMICONDUCTOR
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SMDB05V Datasheet PDF : 19 Pages
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A P CP CW M_4828539:W P _0000001W P _0000001
11. Precaution for use
(1) Storage conditions
•
Keep the product in a dry box or a desiccator with a desiccant in order to prevent
moisture absorption.
a.
Keep it at a temperature in the range from 5C to 30C and at a humidity of
less than 50% RH.
•
The product should be kept within a year.
(2) After opening the package .
•
When soldering, this could result in a decrease of the photoelectric effect or light
intensity.
a.
Soldering should be done right after mounting the product.
b.
Keep the temperature in the range from 5C to 30C and the humidity at less
than 60%.
•
Soldering should be done within 7 days after opening the desiccant package.
If the product has been exposed for more than 7 days after opening the package or
the indicating color of the desiccator changes, the product must be baked at a
temperature between 65 ± 5C for less than 24 hours.
•
An unused and unsealed product should be repacked in a desiccant package and
kept sealed in a dry atmosphere.
•
Stored at a humidity of less than 10% RH.
(3) Precautions for use
•
Any external mechanical force or excessive vibration should not be applied to the
product during cooling after soldering, and it is preferable to avoid rapid cooling.
•
The product should not be mounted on a distorted part of PCB.
•
Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to
prevent ESD and surge damage, and all devices and equipments must be grounded
to the earth.
(4) Miscellaneous
•
Radiation resistance is not considered.
•
When cleaning the product, any kind of fluid such as water, oil and organic solvent
must not be used and IPA(Isopropyl Alcohol) must be used.
•
When using the product, operating current should be settled in consideration of
the maximum ambient temperature.
•
Its appearance or specification for improvement is subject to change without
notice.
[19 /19]
Rev. 00
October, 2012
www.acrich.com
Document No. : QP-7-07-18 (Rev.00) 공통_을
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