M24C16-X Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
M24C16-X Datasheet PDF : 38 Pages
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M24C16, M24C08, M24C04, M24C02, M24C01
Revision history
Date
Version
Changes
29-Apr-2010
Deleted TSSOP8 3x3 mm package from cover page.
Deleted Figure and Table relating to TSSOP8 3x3 mm package
information.
Deleted line and note in Table 24: Ordering information scheme concerning
TSSOP8 3x3 mm package.
In Table 26: Available M24C08 products (package, voltage range,
16 temperature grade) updated UFDFPN8 (MC) package for M24C08-F range
to 5 and deleted line concerning TSSOP8 3x3 mm package.
In Table 27: Available M24C04 products (package, voltage range,
temperature grade) updated UFDFPN8 (MC) package for M24C08-F range
to 5.
In Table 28: Available M24C02 products (package, voltage range,
temperature grade) updated UFDRPN8 options to MB or MC.
Updated:
- Text modified in Section 2.3: Chip Enable (E0, E1, E2).
- Text modified in Section 3.6: Write operations.
- VESD minimum value deleted ofTable 5: Absolute maximum ratings.
- Figure 15: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package
no lead 2 x 3 mm, outline.
15-Apr-2011 17 - E2 (Rev MC): “ddd” has been changed to “eee” and its values modified in
Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no
lead 2 x 3 mm, data.
Added:
- Note at the end of the Section 1: Description.
- Figure footnote below the Figure 3: WLCSP and thin WLCSP connections
(top view, marking side, with balls on the underside).
Doc ID 5067 Rev 17
37/38
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