NCP500(2004) Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

NCP500
(Rev.:2004)

150 mA CMOS Low Noise Low-Dropout Voltage Regulator

ON Semiconductor 

NCP500

PACKAGE DIMENSIONS

TSOP−5

SN SUFFIX

PLASTIC PACKAGE

CASE 483−02

ISSUE C

D

5

S

4

B

1 23

L

G

A

C

0.05 (0.002)

H

J

K

M

SOLDERING FOOTPRINT*

0.95

0.037

1.9

0.074

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. A AND B DIMENSIONS DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

MILLIMETERS INCHES

DIM MIN MAX MIN MAX

A 2.90 3.10 0.1142 0.1220

B 1.30 1.70 0.0512 0.0669

C 0.90 1.10 0.0354 0.0433

D 0.25 0.50 0.0098 0.0197

G 0.85 1.05 0.0335 0.0413

H 0.013 0.100 0.0005 0.0040

J 0.10 0.26 0.0040 0.0102

K 0.20 0.60 0.0079 0.0236

L 1.25 1.55 0.0493 0.0610

M

0 _ 10 _ 0 _ 10 _

S 2.50 3.00 0.0985 0.1181

2.4

0.094

1.0

0.039

0.7

0.028

THIN SOT23−5/TSOP−5/SC59−5

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

18

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