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MSK3015(2001) Ver la hoja de datos (PDF) - M.S. Kennedy

Número de pieza
componentes Descripción
Fabricante
MSK3015
(Rev.:2001)
M-S-Kennedy
M.S. Kennedy M-S-Kennedy
MSK3015 Datasheet PDF : 5 Pages
1 2 3 4 5
ABSOLUTE MAXIMUM RATINGS
VDSS
VDGDR
VGS
ID
IDM
RTH-JC
RTH-JC
Drain to Source Voltage ○ ○ ○ ○ 100V MAX
Drain to Gate Voltage
(R =1M) 100V MAX GS
Gate to Source Voltage
(Continuous)
±20V MAX
Continuous Current ○ ○ ○ ○ ○ ○ ○ 23A MAX
Pulsed Current ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 41A MAX
Thermal Resistance
(Junction to Case)@25°C ○ ○ ○ ○ ○ 1.2°C/W
Thermal Resistance
(Junction to Case)@125°C ○ ○ ○ ○ 2.0°C/W
Single Pulse Avalanche Energy ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 830 mJ
TJ Junction Temperature
+150°C MAX
TST Storage Temperature ○ ○ ○ ○ ○ ○ ○ ○ ○ -55°C to +150°C
TC Case Operating Temperature Range -55°C to +125°C
TLD Lead Temperature Range
(10 Seconds) 300°C MAX
ELECTRICAL SPECIFICATIONS
Parameter
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
Gate-Source Leakage Current
Gate-Source Threshold Voltage
Drain-Source On Resistance 2
Drain-Source On Resistance 3
Forward Transconductance 1
Total Gate Charge 1
Gate-Source Charge 1
Gate-Drain Charge 1
Turn-On Delay Time 1
Rise Time 1
Turn-Off Delay Time 1
Fall Time 1
Input Capacitance 1
Output Capacitance 1
Reverse Transfer Capacitance 1
Body Diode
Forward On Voltage 1
Reverse Recovery Time 1
Reverse Recovery Charge 1
Test Conditions 4
VGS=0 ID=0.25mA
VDS=100V VGS=0V
VGS=±20V VDS=0
VDS=VGS ID=250µA
VGS=10V ID = 23A
VGS=10V ID=23A
VDS=25V ID=23A
ID = 23A
VDS=80V
VGS = 10V
VDD=50V
ID = 23A
RG = 6.2
RD = 1.2
VGS=0V
VDS=25V
f=1MHz
IS=23 A VGS=0V
IS=23 A di/dt=100A/µS
Min.
100
-
-
2.0
-
-
13
-
-
-
-
-
-
-
-
-
-
-
-
-
MSK3015
Typ.
-
-
-
-
-
-
-
-
-
-
16
120
60
81
2800
1100
280
2.5
220
1.9
Max.
-
250
±100
4.0
0.09
0.06
-
140
29
68
-
-
-
-
-
-
-
-
330
2.9
Units
V
µA
nA
V
S
nC
nC
nC
nS
nS
nS
nS
pF
pF
pF
V
nS
µC
NOTES:
1 This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.
2 Resistance as seen at package pins.
3 Resistance for die only; use for thermal calculations.
4 TA=25°C unless otherwise specified.
2
Rev. - 8/01

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