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HSDL-3003-021 Ver la hoja de datos (PDF) - Avago Technologies

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HSDL-3003-021 Datasheet PDF : 21 Pages
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Moisture Proof Packaging
All HSDL-3003 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 25°C,
AND LESS THAN
60% RH?
NO
PACKAGE IS
OPENED MORE
THAN 72 HOURS?
YES
YES
NO BAKING
IS NECESSARY
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
Figure 15. Baking conditions chart.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package
In reels
In bulk
Temp.
60°C
100°C
125°C
150°C
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour
Baking should only be done once.
Recommended
Storage Conditions
Storage Temperature 10°C to 30°C
Relative Humidity below 60% RH
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
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