HV582 Ver la hoja de datos (PDF) - Microchip Technology

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Fabricante

HV582

96-Channel Serial to Parallel Converter with Push-Pull Outputs

Microchip Technology 

HV582

169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]

(Complies with JEDEC Terminal Assignment recommendations)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Notes:

Number of Terminals

Pitch

Overall Height

Standoff

Mold Cap Thickness

Overall Length

Overall Width

Ball Diameter

Units

Dimension Limits

N

e

A

A1

A2

D

E

b

MILLIMETERS

MIN

NOM

MAX

169

0.75 BSC

-

-

1.10

0.21

0.32

-

0.50

0.45

0.50

10.00

10.00

0.35

0.40

0.45

1. Terminal A1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated

3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-377-J Rev C Sheet 2 of 2

 2015 Microchip Technology Inc.

DS20005455A-page 13

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