PL610-01
7.0 PACKAGING INFORMATION
6-Pin TDFN 2.0 mm x 1.3 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2016 Microchip Technology Inc.
DS20005615A-page 11