NTD20N03L27T4G(2011) Ver la hoja de datos (PDF) - ON Semiconductor
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NTD20N03L27T4G Datasheet PDF : 5 Pages
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NTD20N03L27, NVD20N03L27
PACKAGE DIMENSIONS
L3
L4
b2
e
E
b3
4
12 3
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
C
A
A
B
c2
D
DETAIL A
H
b
c
0.005 (0.13) M C
H
L2
GAUGE
PLANE
L
A1
L1
DETAIL A
ROTATED 905 CW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
Z
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
SEATING
PLANE
INCHES
DIM MIN MAX
A 0.086 0.094
A1 0.000 0.005
b 0.025 0.035
b2 0.030 0.045
b3 0.180 0.215
c 0.018 0.024
c2 0.018 0.024
D 0.235 0.245
E 0.250 0.265
e 0.090 BSC
H 0.370 0.410
L 0.055 0.070
L1 0.108 REF
L2 0.020 BSC
L3 0.035 0.050
L4 −−− 0.040
Z 0.155 −−−
MILLIMETERS
MIN MAX
2.18 2.38
0.00 0.13
0.63 0.89
0.76 1.14
4.57 5.46
0.46 0.61
0.46 0.61
5.97 6.22
6.35 6.73
2.29 BSC
9.40 10.41
1.40 1.78
2.74 REF
0.51 BSC
0.89 1.27
−−− 1.01
3.93 −−−
SOLDERING FOOTPRINT*
6.20
0.244
3.0
0.118
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
2.58
0.101
5.80
0.228
1.6 6.172
0.063 0.243
ǒ Ǔ SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
NTD20N03L27/D
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