Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits
English
한국어
日本語
русский
简体中文
español
Número de pieza
componentes Descripción
HCS112MS Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
HCS112MS
Radiation Hardened Dual JK Flip-Flop
Intersil
HCS112MS Datasheet PDF : 9 Pages
1
2
3
4
5
6
7
8
9
Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
KA
(2)
HCS112MS
HCS112MS
CP1
(1)
VCC
(16)
JA (3)
SA (4)
QA (5)
QA (6)
(15) RA
(14) RB
(13) CPB
(12) KB
QB (7)
(11) JB
(8)
(9)
(10)
GND
QB
SB
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS112 is TA14341A.
Spec Number
518830
19
Share Link:
datasheetq.com [
Privacy Policy
]
[
Request Datasheet
] [
Contact Us
]