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RJK005N03FRA Ver la hoja de datos (PDF) - ROHM Semiconductor

Número de pieza
componentes Descripción
Fabricante
RJK005N03FRA
ROHM
ROHM Semiconductor ROHM
RJK005N03FRA Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
RJK005N03FRA
          
lThermal resistance
Parameter
Thermal resistance, junction - ambient
                Datasheet
                    
Symbol
RthJA*2
Values
Unit
Min. Typ. Max.
-
- 625 /W
lElectrical characteristics (Ta = 25°C)
Parameter
Symbol
Conditions
Drain - Source breakdown
voltage
V(BR)DSS VGS = 0V, ID = 1mA
Breakdown voltage
temperature coefficient
 ΔV(BR)DSS  ID = 1mA
   ΔTj     referenced to 25
Zero gate voltage
drain current
IDSS VDS = 30V, VGS = 0V
Gate - Source leakage current IGSS VGS = ±12V, VDS = 0V
Gate threshold voltage
VGS(th) VDS = 10V, ID = 1mA
Gate threshold voltage
temperature coefficient
 ΔVGS(th)   ID = 1mA
   ΔTj     referenced to 25
Static drain - source
on - state resistance
RDS(on)*3
VGS = 4.5V, ID = 500mA
VGS = 4.0V, ID = 500mA
VGS = 2.5V, ID = 500mA
Forward Transfer
Admittance
|Yfs|*3 VDS = 10V, ID = 500mA
Values
Unit
Min. Typ. Max.
30 -
-
V
- 35.0 - mV/
-
-
1 μA
-
- ±10 μA
0.8 - 1.5 V
- -2.04 - mV/
- 400 580
- 420 600 mΩ
- 650 940
500 -
- mS
*1 Pw10μs , Duty cycle1%
*2 Each terminal mounted on a reference land.
*3 Pulsed
                                             
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
2/5
                                          
20160920 - Rev.001

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