Q62702-G0080(1999) Ver la hoja de datos (PDF) - Infineon Technologies

Número de pieza

componentes Descripción

Fabricante

Q62702-G0080
(Rev.:1999)

GaAs MMIC

Infineon Technologies 

GaAs MMIC

CGY 196

_________________________________________________________________________________________________________

SIEMENS

High Frequency Semiconductors

Type

Package

CGY196 GaAs MMIC

SCT598

Key-word

Notes on Processing

File

C:\TEMP\SCT595-

C196_PriLötempf.doc

Date

05.02.1999

Preliminary soldering recommendation

• Foot Print

drawing C63060-A2123-A001-01-0027

• Soldering

soldering profile:

ramp-up preheating

ramp-up peak

exposure to molten solder

typ. solder temperature

peak temperature

ramp-down

comments

• Solder paste thickness

• Control of soldering (voids)

• Jedec A-112A

• IPC-9501 (IPC-4202)

wave soldering:

reflow soldering:

(IR or VPR)

unsuitable

suitable, max. 3 times

temperature gradient:

time at 100 - 150 °C:

temperature gradient

above 183°C

typ. 215-245°C

max. peak 260°C

temperature gradient:

max. + 2 K/sec

min. 90 sec.

max. + 6 K/sec

max. 150 sec

max. 30 sec.

max. 10 sec.

min. - 6°C/sec

(see also soldering standard profile of databook ‘package

information’)

slow ramp-up, long preheating phase and low max.

temperature recommended

150 - 200 µm

- visual inspection

- cross sectioning

- measurement of case temperature /

thermal resistance case to ambient

level 1

storage floor life at 30°C/90% unlimited

level 111

storage floor life at 30°C/60% unlimited

IR/Convection; max. 245°C; < 6K/sec.

Infineon Aktiengesellschaft

21

01.3.1999

GS PD GaAs

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