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MPC7410 Datasheet PDF : 56 Pages
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Package Description
7.4 Mechanical Dimensions for the MPC7410, 360 HCTE_CBGA
(Lead Free C5 Spheres)
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the MPC7410,
360 HCTE_CBGA (lead-free C5 spheres) package.
A1 CORNER
E E2 E4
2X
0.2 Capacitor Region
D
A
D2
D4
C
0.15 C
// 0.25 C
// 0.35 C
L2 L1
K3
2X
0.2
B
L3
K2
K1
L4
K4
1 2 3 4 5 6 7 8 9 10 11 1213141516 171819
W
V
U
T
R
P
N
F
M
L
K
J
A3
H
A2
G
F
A4
E
A1
D
A
C
B
A
e
F
Millimeters
DIM
MIN
MAX
A
2.32
2.80
A1
0.40
0.60
A2
1.10
1.30
A3
—
0.60
A4
0.82
0.90
b
0.60
0.90
D
25.00 BSC
D2
—
12.50
D4
6.00
9.00
e
1.27 BSC
E
25.00 BSC
E2
—
14.30
E4
8.00
11.00
F
22.86 BSC
K1
—
9.75
K2
6.46
—
K3
8.20
8.60
K4
2.75
—
L1
—
9.50
L2
6.94
—
L3
3.10
3.30
L4
3.00
—
360X b
0.3 C A B
0.15 C
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH
VARIOUS SHAPES. BOTTOM SIDE A1
CORNER IS DESIGNATED WITH A
BALL MISSING FROM THE ARRAY.
Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7410
360 HCTE_CBGA (Lead-Free C5 Spheres) Package
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
31
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