MPC7410PDP Ver la hoja de datos (PDF) - Unspecified

Número de pieza

componentes Descripción

Fabricante

MPC7410PDP

MPC7410 RISC Microprocessor Hardware Specifications

Unspecified 

Pin Assignments

5 Pin Assignments

Figure 16, part A shows the pinout for the MPC7410, 360 CBGA, 360 HCTE, and 360 HCTE Lead Free C5 Spheres

packages as viewed from the top surface. Figure 16, part B shows the side profile of the CBGA and HCTE_CBGA

packages to indicate the direction of the top surface view. Figure 16, part C shows the side profile of the

HCTE_LGA package to indicate the direction of the top surface view.

Part A

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

V

W

Part B

Not to Scale

Substrate Assembly

Encapsulant

View

BGA Package

Die

MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

24

Freescale Semiconductor

Share Link: