Package Dimensions
unit : mm
TQFP120 14x14 / TQFP120
CASE 932AZ
ISSUE A
16.00.2
14.00.1
LC75847T
(1.2)
12
0.4
0.15
0.10
0.125
0.10
SOLDERING FOOTPRINT*
15.40
(Unit: mm)
0 to 10
GENERIC
MARKING DIAGRAM*
XXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
0.40
0.23
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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