CXD3021 Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXD3021 Datasheet PDF : 161 Pages
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Package Outline
Unit: mm
90
91
120PIN LQFP (PLASTIC)
18.0 ± 0.2
16.0 ± 0.1
61
60
1.7 MAX
1.4 ± 0.1
S
0.1 S
B
A
120
1
0.5
0.1 ± 0.05
0.25
0.22 ± 0.05
31
30
0.1 M S
0.22 ± 0.05
(0.2)
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
90
91
DETAIL B
LQFP-120P-L01
LQFP120-P-1616
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.8g
120PIN LQFP(PLASTIC)
18.0 ± 0.2
16.0 ± 0.1
61
60
1.7MAX
1.4 ± 0.1
B
120
1
0.5
b
0.25
0.1 ± 0.05
A
31
30
0.10 M S
b=0.22 ± 0.05
(0.2)
0.10 S
S
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
LQFP-120P-L051
P-LQFP120-16x16-0.5
DETAIL B
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
SOLDER
COPPER ALLOY
PACKAGE WEIGHT
0.8g
– 161 –
CXD3021R
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