TOP209 Ver la hoja de datos (PDF) - Power Integrations, Inc
Número de pieza
componentes Descripción
Fabricante
TOP209 Datasheet PDF : 16 Pages
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TOP209/210
DIP-8
DIM inches
mm
A 0.370-0.385 9.40-9.78
B 0.245-0.255 6.22-6.48
C 0.125-0.135 3.18-3.43
G 0.015-0.040 0.38-1.02
H 0.120-0.135 3.05-3.43
J1 0.060 (NOM) 1.52 (NOM)
J2 0.014-0.022 0.36-0.56
K 0.010-0.012 0.25-0.30
L 0.090-0.110 2.29-2.79
M 0.030 (MIN) 0.76 (MIN)
N 0.300-0.320 7.62-8.13
P 0.300-0.390 7.62-9.91
Q 0.300 BSC 7.62 BSC
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB for standard dual
in-line (DIP) package .300 inch row spacing
(PLASTIC) 8 leads (issue B, 7/85)..
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
4. D, E and F are reference datums on the
molded body.
D S .004 (.10)
8
5
-E-
B
1
4
A
-D-
M
J1
C
-F-
G
H
K
J2
L
N
Q
P
P08A
PI-2076-041101
SMD-8
D S .004 (.10)
8
5
-E-
Heat Sink is 2 oz. Copper
As Big As Possible
B
P
1
4
L
A
-D-
M
J1
.420
.046 .060 .060 .046
.080
Pin 1
.086
.186
.286
Solder Pad Dimensions
J3
G08A
C
-F-
J4
α
G
J2 .010 (.25) M A S
K
.004 (.10)
H
DIM inches
mm
A 0.370-0.385 9.40-9.78
B 0.245-0.255 6.22-6.48
C 0.125-0.135 3.18-3.43
G 0.004-0.012 0.10-0.30
H 0.036-0.044 0.91-1.12
J1 0.060 (NOM) 1.52 (NOM)
J2 0.048-0.053 1.22-1.35
J3 0.032-0.037 0.81-0.94
J4 0.007-0.011 0.18-0.28
K 0.010-0.012 0.25-0.30
L 0.100 BSC 2.54 BSC
M 0.030 (MIN) 0.76 (MIN)
P 0.372-0.388 9.45-9.86
α
0-8°
0-8°
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
4. D, E and F are reference datums on the
molded body.
PI-2077-042601
15 A
8/97
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