AD7533_04 Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
AD7533_04 Datasheet PDF : 8 Pages
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Die Characteristics
DIE DIMENSIONS
101 mils x 103 mils (2565µm x 2616µm)
METALLIZATION
Type: Pure Aluminum
Thickness: 10 ±1kÅ
AD7533
PASSIVATION
Type: PSG/Nitride
PSG: 7 ±1.4kÅ
Nitride: 8 ±1.2kÅ
PROCESS
CMOS Metal Gate
Metallization Mask Layout
PIN 7
BIT 4
PIN 6
BIT 3
AD7533
PIN 5
BIT 2
PIN 4
BIT 1
(MSB)
PIN 8
BIT 5
PIN 9
BIT 6
PIN 10
BIT 7
PIN 11
BIT 8
(LSB)
PIN 3
GND
PIN 2
IOUT2
PIN 1
IOUT1
PIN 16
RFEEDBACK
PIN 15
VREF
NC
(PIN 12, BIT 9, AD7533)
NC
NC
(PIN 13, BIT 10, AD7533)
NC
PIN 14
V+
7
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