16 Mbit / 32 Mbit Multi-Purpose Flash Plus
SST39VF1601 / SST39VF3201
SST39VF1602 / SST39VF3202
Data Sheet
TOP VIEW
8.00 ± 0.20
6
5
4
3
2
1
ABCDEFGH
A1 CORNER
SIDE VIEW
6.00 ± 0.20
1.10 ± 0.10
BOTTOM VIEW
5.60
0.80
0.45 ± 0.05
(48X)
6
5
4.00
4
3
2
1
0.80
HGFEDCBA
A1 CORNER
0.12
SEATING PLANE
1mm
0.35 ± 0.05
Note:
1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
48-tfbga-B3K-6x8-450mic-4
FIGURE 26: 48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
SST Package Code: B3K
TABLE 17: Revision History
Number
00 • Initial release
Description
01 • Corrected Pin 15 from A20 to NC for SST39VF160x in Figure 2 on page 6
02 • Changed data sheet title
03 • 2004 Data Book
• Updated the B3K and B1K package diagrams
• Added non-Pb MPNs and removed footnote. (See page 29)
04 • Added RoHS compliance information on page 1 and in the “Product Ordering Infor-
mation” on page 28
• Corrected the solder temperature profile in “Absolute Maximum Stress Ratings” on
page 12
• Changed product status from “Preliminary Specifications” to “Data Sheet”
05 • Removed 90 ns Read Access Time globally
• EOLed all lead (Pb) valid combinations. See S71223(02)
• EOLed SST39VF6401 and SST39VF6402. See S71223(03)
Date
Mar 2003
Apr 2003
Jun 2003
Nov 2003
Nov 2005
June 2008
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.sst.com
©2008 Silicon Storage Technology, Inc.
31
S71223-05-000
6/08