TJA1020 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza

componentes Descripción

Fabricante

TJA1020

LIN transceiver

NXP Semiconductors. 

Philips Semiconductors

LIN transceiver

Product specification

TJA1020

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

copyright, or mask work right to these products, and

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

Bare die  All die are tested and are guaranteed to

comply with all data sheet limits up to the point of wafer

sawing for a period of ninety (90) days from the date of

Philips' delivery. If there are data sheet limits not

guaranteed, these will be separately indicated in the data

sheet. There are no post packing tests performed on

individual die or wafer. Philips Semiconductors has no

control of third party procedures in the sawing, handling,

packing or assembly of the die. Accordingly, Philips

Semiconductors assumes no liability for device

functionality or performance of the die or systems after

third party sawing, handling, packing or assembly of the

die. It is the responsibility of the customer to test and

qualify their application in which the die is used.

2004 Jan 13

21

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