SOT-25 Ver la hoja de datos (PDF) - TOREX SEMICONDUCTOR
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SOT-25 Datasheet PDF : 5 Pages
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●SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm（1600mm2 in one side）
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used)
Material : Glass Epoxy（FR-4）
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature（85℃）
Evaluation Board (Unit: mm)
Board Mount ( Tjmax=125℃)
Ambient
Power
Temperature
Dissipation
(℃)
Pd (mW)
25
600
85
240
Thermal
Resistance
(℃/W）
166.67
700
600
500
400
300
200
100
0
25
Pd vs Ta
45
65
85
105
125
Ambient Temperature Ta（℃）
3. Power Dissipation vs. Ambient temperature（105℃）
Board Mount ( Tjmax=125℃)
Ambient
Power
Temperature
Dissipation
(℃)
Pd (mW)
25
600
105
120
Thermal
Resistance
(℃/W）
166.67
700
600
500
400
300
200
100
0
25
Pd vs Ta
45
65
85
105
Ambient Temparature Ta（℃）
125
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