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M24128-BFBN3/B Ver la hoja de datos (PDF) - STMicroelectronics

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M24128-BFBN3/B Datasheet PDF : 34 Pages
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Revision history
10 Revision history
M24128, M24C64, M24C32
Table 24. Document revision history
Date
Revision
Changes
22-Dec-1999
28-Jun-2000
31-Oct-2000
20-Apr-2001
16-Jan-2002
02-Aug-2002
04-Feb-2003
2.3
TSSOP8 package in place of TSSOP14 (pp 1, 2, OrderingInfo,
PackageMechData).
2.4 TSSOP8 package data corrected
References to Temperature Range 3 removed from Ordering Information
2.5 Voltage range -S added, and range -R removed from text and tables
throughout.
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
2.6 Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data
updated
Test condition for ILI made more precise, and value of ILI for E2-E0 and
2.7 WC added
-R voltage range added
Document reformatted using new template.
2.8 TSSOP8 (3x3mm² body size) package (MSOP8) added.
5ms write time offered for 5V and 2.5V devices
2.9 SO8W package removed. -S voltage range removed
27-May-2003
22-Oct-2003
01-Jun-2004
04-Nov-2004
05-Jan-2005
2.10 TSSOP8 (3x3mm² body size) package (MSOP8) removed
Table of contents, and Pb-free options added. Minor wording changes in
3.0 Summary Description, Power-On Reset, Memory Addressing, Write
Operations, Read Operations. VIL(min) improved to -0.45V.
Absolute Maximum Ratings for VIO(min) and VCC(min) improved.
4.0 Soldering temperature information clarified for RoHS compliant devices.
Device Grade clarified
Product List summary table added. Device Grade 3 added. 4.5-5.5V
5.0
range is Not for New Design. Some minor wording changes. AEC-Q100-
002 compliance. tNS(max) changed. VIL(min) is the same on all input
pins of the device. ZWCL changed.
6.0 UFDFPN8 package added. Small text changes.
32/34

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