ML9041 Ver la hoja de datos (PDF) - Oki Electric Industry
Número de pieza
componentes Descripción
Fabricante
ML9041 Datasheet PDF : 55 Pages
| |||
¡ Semiconductor
PAD CONFIGURATION
Y
Pad Layout
Chip Size
: 10.62 ¥ 2.55mm
Chip Thickness : 625±20mm
Bump Size (1) : 72 ¥ 72mm
Bump Size (2) : 54 ¥ 96mm
182
183
189
1
ML9041
63
62
X
56
55
Pad Coordinates
Pad
Symbol
X (mm) Y (mm)
Pad
Symbol
X (mm) Y (mm)
1
V1
–5103 –1100
21
DB3
–1323 –1100
2
V2
–4914 –1100
22
DB2
–1134 –1100
3
V3A
–4725 –1100
23
DB1
–945 –1100
4
V3B
–4536 –1100
24
DB0
–756 –1100
5
V4
6
V5
–4347
–4158
–1100
–1100
25
E
26
R/W
–567
–378
–1100
–1100
7
V5IN
–3969 –1100
27
RS0
–189 –1100
8
VCC
–3780 –1100
28
RS1
0 –1100
9
VC
–3591 –1100
29
SO
189 –1100
10
VIN
11
BEB
–3402
–3213
–1100
–1100
30
SI
31
SHT
378 –1100
567 –1100
12
VDD
–3024 –1100
32
CS
756 –1100
13
CSR
–2835 –1100
33
OSC2
945 –1100
14
SSR
15
P/S
–2646
–2457
–1100
–1100
34
OSCR
35
OSC1
1134
1323
–1100
–1100
16
VSS
–2268 –1100
36
T3
1512 –1100
17
DB7
–2079 –1100
37
T2
1701 –1100
18
DB6
–1890 –1100
38
T1
1890 –1100
19
DB5
–1701 –1100
39
COM1
2079 –1100
20
DB4
–1512 –1100
40
COM2
2268 –1100
52/54
Share Link: 