0.36
(0.014)
DIMENSION SHOWN FOR MOUNTING MODULE
1.98 FLUSH TO PANEL. THICKER PANEL WILL
(0.078) RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
(10..2075)OPTIONAL SEPTUM
30.2
(1.19)
13.82
(0.544)
26.4
(1.04)
KEEP OUT ZONE
10.82 14.73
(0.426) (0.58)
BOTTOM SIDE OF PCB
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 9. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-53D5FM.
Ordering Information
850 nm VCSEL (SX – Short Wavelength Laser)
HFBR-53D5
No shield, plastic housing.
HFBR-53D5EM
Extended/protruding shield, metallized housing.
HFBR-53D5FM
Flush shield, metallized housing.
1300 nm FP Laser (LX – Long Wavelength Laser)
HFCT-53D5EM
Extended/protruding shield, metallized housing.
HFCT-53D5FM
Flush shield, metallized housing.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 1999 Agilent Technologies, Inc.
5968-3183E (11/99)