AS1150 Ver la hoja de datos (PDF) - austriamicrosystems AG
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AS1150 Datasheet PDF : 15 Pages
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AS1150, AS1151
Data Sheet
10 Package Drawings and Markings
Figure 22. 16-Pin TSSOP Package
austriamicrosystems
Board Layout
Symbol
A
A1
A2
L
R
R1
b
b1
c
c1
0.65mm Lead Pitch 1, 2
Min
Nom
Max
-
-
1.10
0.05
-
0.15
0.85
0.90
0.95
0.50
0.60
0.75
0.09
-
-
0.09
-
-
0.19
-
0.30
0.19
0.22
0.25
0.09
-
0.20
0.09
-
0.16
D
4.90
5.00
5.10
E1
4.30
4.40
4.50
E
6.4 BSC
Note
5
Symbol
θ1
L1
aaa
bbb
ccc
ddd
e
θ2
θ3
0.65mm Lead Pitch 1, 2
Min Nom Max
0º
-
8º
1.0 Ref
0.10
0.10
0.05
0.20
0.65 BSC
12º Ref
12º Ref
Variations
3, 8
e
4, 8
N
0.65 BSC
16
Note
6
Notes:
1. All dimensions are in millimeters; angles in degrees.
2. Dimensions and tolerancing per ASME Y14.5M-1994.
3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15mm per side.
4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm
per side.
5. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of
dimension b at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm for 0.5mm pitch packages.
6. Terminal numbers shown are for reference only.
7. Datums A and B to be determined at datum plane H.
8. Dimensions D and E1 to be determined at datum plane H.
9. This dimension applies only to variations with an even number of leads per side. For variations with an odd number
of leads per package, the center lead must be coincident with the package centerline, datum A.
10. Cross section A-A to be determined at 0.10 to 0.25mm from the leadtip.
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Revision 1.19
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