C0603H101J5GACTU Ver la hoja de datos (PDF) - Unspecified
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C0603H101J5GACTU Datasheet PDF : 24 Pages
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
P2
T2
ØDo
Po [10 pitches cumulative
E1
tolerance on tape ± 0.2 mm]
Ko
B1
Ao
Bo
F
W
E2
S1
P1
T1
Center Lines of Cavity
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
User Direction of Unreeling
ØD 1
Embossment
For cavity size,
see Note 1 Table 4
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
D1 Minimum
Note 1
E1
P0
P2
R Reference S1 Minimum T
Note 2 Note 3 Maximum
8 mm
1.0
(0.039)
25.0
(0.984)
12 mm
1.5+0.10 −0.0
(0.059+0.004 −0.0)
16 mm
1.5
(0.059)
1.75±0.10
4.0±0.10
2.0±0.05
(0.069±0.004) (0.157±0.004) (0.079±0.002)
30
(1.181)
0.600
(0.024)
0.600
(0.024)
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
Single (4 mm)
B1 Maximum
Note 4
4.35
(0.171)
E2
Minimum
6.25
(0.246)
F
P1
3.5±0.05
4.0±0.10
(0.138±0.002) (0.157±0.004)
T2
Maximum
2.5
(0.098)
W
Maximum
8.3
(0.327)
A0,B0 & K0
12 mm
Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
8.0±0.10
4.6
(0.217±0.002) (0.315±0.004) (0.181)
12.3
(0.484)
Note 5
16 mm
Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
12.0±0.10
4.6
(0.138±0.002) (0.157±0.004) (0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(See Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 7/29/2016 16
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