DSS1NB32A331Q91A Ver la hoja de datos (PDF) - Unspecified
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DSS1NB32A331Q91A Datasheet PDF : 10 Pages
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Spec No. JENF243F-0031-01
Reference
4. Style and Dimension
See item 9.
5. Marking
Trade Mark ： Marked as
Capacitance ：Marked three digits system. (Ex.221)
Rated Voltage ：Marked voltage value.(100V)
Only
P3/9
6. Testing Conditions
<Unless otherwise specified>
Temperature : Ordinary Temperature 15 to 35°C
Humidity : Ordinary Humidity 25 to 85 %(RH)
<In case of doubt>
Temperature : 20 ± 2°C
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
7. Performance
No.
Item
7.1 Appearance and
Dimensions
7.2 Marking
7.3 Capacitance and
Tolerance
Specification
Meet item 9.
Marking is able to be read easily.
Meet item 3.
Test Method
Visual Inspection and measured with Slide
Calipers.
Visual Inspection.
Table 2
Frequency Test Voltage
1±0.1MHz 1±0.2Vrms
Capacitance
22pF～150pF
1±0.1kHz 1±0.2Vrms
220pF～100nF
7.4 Insulation
Resistance(I.R.)
7.5 Withstanding
Voltage
Meet item 3.
Products shall not be damaged.
7.6 Temperature
Meet item 3.
Characteristics
Test Voltage : Rated Voltage
Time : 1 minute through a suitable resistor 1Mï—
Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 10 mA max.
It shall be applied between input / output terminal
and ground terminal.
Capacitance shall be measured at each step specified
in Table 3 after reaching the thermal equilibrium.
The capacitance change against the capacitance at
step 3 shall be calculated.
Table3
Step
1
2
3
4
5
Temp. +20±2 -40±2 +20±2 +85±2 +20±2
(°C)
7.7 Solderability
Along the circumference of terminal
Flux : Ethanol solution of rosin,25(wt)%
shall be covered with new solder at least (dipped for 5 to 10 seconds)
75%.
Pre-heat : 150±10℃, 60～90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature 245±5℃
Immersion Time : 2 ± 0.5 seconds
Immersion Depth :
2 to 2.5 mm from the bottom of the body.
7.8 Resistance to Meet Table 4.
Flux : Ethanol solution of rosin,25(wt)%
Soldering Heatâ‘ Table 4
Appearance
Capacitance
Change
Withstanding
Voltage
No damaged.
within ± 30%
No damaged.
(dipped for 5 to 10 seconds)
Pre-heat : 150±10℃, 60～90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5 °C
Immersion Time : 3± 0.5 seconds
Immersion Depth :
1.6 ± 0.7 mm from the bottom of the body.
Then measured after exposure in the room
condition for 4 to 24hours.
Resistance to
Soldering iron output: 30W
Soldering Heatâ‘¡
Tip temperature : 370±10°C
Soldering time : 5s(+0/-1s)
MURATA MFG.CO., LTD
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