VNQ5050KTR-E Ver la hoja de datos (PDF) - STMicroelectronics

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componentes Descripción

Fabricante

VNQ5050KTR-E

Quad channel high side driver for automotive applications

STMicroelectronics 

Package and PC board thermal data

4

Package and PC board thermal data

4.1

PowerSSO-24 thermal data

Figure 31. PowerSSO-24 PC board

VNQ5050K-E

Note:

Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4

area= 77 mm x 86 mm,PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),

Copper areas: from minimum pad lay-out to 8 cm2).

Figure 32. Rthj-amb vs PCB copper area in open box free air condition (one channel on)

RTHj_amb(°C/W)

55

50

45

40

35

30

0

2

4

6

8

10

PCB Cu heatsink area (cm^2)

24/31

Doc ID 10864 Rev 7

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