MGA-43024-BLKG Ver la hoja de datos (PDF) - Avago Technologies

Número de pieza

componentes Descripción

Fabricante

MGA-43024-BLKG

2.4 GHz WLAN Power Amplifier Module

Avago Technologies 

PCB Land Pattern and Stencil Outline

5.00

3.60

Pin1

5.00

0.40

0.75

0.60

∅ 0.30

0.45

0.80

0.25

0.68

1.25 3.70

0.50

0.05

4.77

0.23

0.50

1.13 0.82

3.24

1.52

SolderMask

Opening

0.50

(pitch)

0.25

PCB Land Pattern

SolderMask

0.27

0.50

Stencil Opening

5.00

3.60

3.24

0.45

1.82

1.13 4.77

0.68

0.80

Top Metal

Notes:

1. Recommended Land Pattern and Stencil.

2. 4 mils stencil thickness recommended.

3. All dimensions are in mm.

3.60 5.00

0.05

Combination of Land Pattern and Stencil Opening

14

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