74LVC1G04FS3-7 Ver la hoja de datos (PDF) - Diodes Incorporated.

Número de pieza

componentes Descripción

Fabricante

74LVC1G04FS3-7

SINGLE INVERTER

Diodes Incorporated. 

74LVC1G04

Electrical Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)

Symbol Parameter

Test Conditions

VOH

VOL

II

IOFF

ICC

ΔICC

Ci

High-Level

Output Voltage

Low-Level

Output Voltage

Input Current

Power Down

Leakage

Current

Supply Current

Additional

Supply Current

Input

Capacitance

IOH = -100μA

IOH = -4mA

IOH = -8mA

IOH = -12mA

IOH = -16mA

IOH = -24mA

IOH = -32mA

IOL = 100μA

IOL = 4mA

IOL = 8mA

IOL = 12mA

IOL = 16mA

IOL = 24mA

IOL = 32mA

VI = 5.5 V or GND

VI or VO = 5.5V

VI = 5.5V or GND

IO=0

Input at

VCC –0.6V

Vi = VCC – or GND

-40°C to +85°C

-40°C to +125°C

VCC

Unit

Min

Typ.

Max

Min

Max

1.65V to 5.5V VCC – 0.1

—

1.65V

1.2

—

—

VCC – 0.1

—

—

0.95

—

2.3V

1.9

—

—

1.7

—

2.7V

2.2

—

—

1.9

—

V

2.4

—

—

2.2

—

3V

2.3

—

—

2.0

—

4.5V

3.8

—

—

3.4

—

1.65V to 5.5V

—

—

0.1

—

0.1

1.65V

—

—

0.45

—

0.7

2.3V

—

—

0.3

—

0.45

2.7V

—

—

0.4

—

0.6

V

—

—

0.4

—

0.6

3V

—

—

0.55

—

0.8

4.5V

—

—

0.55

—

.8

0 to 5.5V

—

± 0.1

±5

—

± 100

μA

0V

—

—

±10

—

±200

μA

5.5V

—

0.1

10

—

200

μA

3V to 5.5V

—

—

500

—

5,000

μA

3.3V

—

5

—

—

—

pF

Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)

Symbol

θJA

θJC

Parameter

Thermal Resistance

Junction-to-Ambient

Thermal Resistance

Junction-to-Case

Test Conditions

SOT25

SOT353

SOT553

X2-DFN0808-4

X1-DFN1010-6 (Type B)

X2-DFN1010-6

X2-DFN1409-6

X2-DFN1410-6

SOT25

SOT353

SOT553

X2-DFN0808-4

X1-DFN1010-6 (Type B)

X2-DFN1010-6

X2-DFN1409-6

X2-DFN1410-6

VCC

(Note 10)

(Note 10)

Min

Typ

Max

Unit

—

204

—

—

371

—

—

231

—

—

400

—

°C/W

—

435

—

—

445

—

—

470

—

—

460

—

—

52

—

—

143

—

—

105

—

—

225

—

°C/W

—

250

—

—

250

—

—

275

—

—

265

—

Note:

10. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

74LVC1G04

Document number: DS32198 Rev. 10 - 2

4 of 16

www.diodes.com

April 2016

© Diodes Incorporated

Share Link: