Low Mating Force Rectangular Connectors
how to order (commercial types)
MB, DB, I/O, PC Connectors
Proprietary Part Number Ordering Procedure
Example part number MB2-120P- (â ) is shown as follows:
MB
2-
120 P - (â )
Body Type
Number of Rows
Total Number of Contacts
Termination Style
Variation Suffix
Body Type
MB designates Mother Board
DB designates Daughter Board
I/O designates Input/Output
PC designates Printed Circuit
Number of Rows
2, 3 or 4 rows
Total Number of Contacts
See Contact Arrangements, pages 8 and 9
Standard Termination Style
(Stickout values below apply to âJâ dimension referenced on
individual connector catalog pages).
MBX-XXXP
MBX-XXXW
DBX-XXXP
IOX-XXXC
IOX-XXXP
PCX-XXXP
Straight PCB stud,â .021 dia,â .113 ±.025
stickÂout, Sn/Ni plate
Solderless wrap,â .025 sq.,â .507 ±.025
stickout, Sn/Ni plate
90° PCB stud,â .021 dia,â .085 ±.025 stickout,
Sn/Ni plate
Crimp, rear removable contact, size 22D wire
well, Sn/Ni plate
PCB stud,â .021 dia,â .145 ±.025 stickout,
Sn/Ni plate
90° PCB stud,â .021 dia., .095
+.035
â.025
stickout
Sn/Ni plate
LEGEND:
Sn/Ni designates Tin over Nickel
Au/Ni designates Gold over Nickel
Au/Cu designates Gold over Copper
Amphenol
RoHS
U / 2002 / 95 / E
SnPb/Cu designates Tin-Lead over Copper
Variation Suffix
(Stickout values below apply to âJâ dimension referenced
on â individual connector catalog pages.)
(700)
(701)
(702)
(703)
(704)
(705)
(706)
(707)
(709)
(710)
(711)
(713)
(714)
(715)
(716)
(717)
(718)
(719)
(720)
(721)
(722)
(723)
(724)
(725)
(726)
(727)
(728)
(729)
(730)
(731)
Gold plate in accordance with MIL-G-45204, type
II,â .000030 min. thick gold (.000050 for solderless wrap)
overâ .000050 min. thick nickel (standard
termination length)
Gold plate in accordance with MIL-G-45204, type
II,â .000050 min. thick gold overâ .00015 min. thick
copper (standard termination length)
PCB stud stickout ofâ .145, Sn/Ni plate, MB-P
Au/Ni [same as (700)], PCB stud stickout ofâ .145, MB-P
Au/Cu [same as (701)], PCB stud stickout ofâ .145, MB-P
90° PCB stud,â .120 stickout. Sn/Ni plate, DB
Au/Ni [same as (700)], 90° PCB studâ .120 stickout, DB
Au/Cu [same as (701)], 90° PCBâ .120 stickout, DB
PCB stud stickout ofâ .300 DB (90°),â .300 MB-P &
.335 IO-P, Sn/Ni plate
Solderless wrap,â .025 sq.,â .665 stickout, Sn/Ni plate,
MB-W
Solderless wrap,â .025 sq.,â .665 stickout, Au/Ni,
[same as (700)], MB-W
PCB stud stickout ofâ .060, Sn/Ni plate, IO-P
90° PCB stud stickout ofâ .150, Sn/Ni plate, PC & DB
Solderless wrap,â .025 sq.,â .665 stickout, Au/Cu
[same as (701)], MB-W
90° PCB stud stickout ofâ .085 matte tin, DB
90° PCB stud stickout ofâ .095 matte tin, PC
90° PCB stud stickout ofâ .120 matte tin, DB
PCB stud stickout ofâ .300 MB-P &â .335 IO-P, matte tin
PCB stud stickout ofâ .060 matte tin, IO-P
PCB stud stickout ofâ .500, Sn/Ni plate, IO-P
PCB stud stickout ofâ .356 matte tin, MB-P
PCB stud stickout ofâ .192, Sn/Ni plate, MB-P
90° PCB stud stickout ofâ .095, RTV potted rear,
Sn/Ni plate, PC
90° PCB stud stickout ofâ .120, RTV potted rear,
Sn/Ni plate, DB
90° PCB stud stickout ofâ .150, RTV potted rear,
Sn/Ni plate, PC & DB
PCB stud stickout ofâ .145, RTV potted rear,
Sn/Ni plate, MB-P
PCB stud stickout ofâ .145, Au/Ni, [same as (700)],
RTV potted rear, MB-P
90° PCB stud stickout ofâ .120, Au/Ni, [same as (700)],
RTV potted rear, DB
90° PCB stud stickout ofâ .150, Au/Ni, [same as (700)
above], PC and DB
PCB stud stickout ofâ .145, matte tin, MB-P
Variation Suffixes continued on next page.
4