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25Q64BV Ver la hoja de datos (PDF) - Winbond

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componentes Descripción
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25Q64BV Datasheet PDF : 61 Pages
First Prev 61
W25Q64BV
15. REVISION HISTORY
VERSION
A
B
C
D
E
DATE
08/24/08
01/15/09
03/12/09
3/13/09
08/20/09
09/24/09
07/08/10
PAGE
56 & 57
57
5
13
38, 39, 54~56 &
58
44
52
5,7,55,58,59
44
46
61
55-58
50, 53
DESCRIPTION
New Create Preliminary
P character added to end of a Part Number
Corrected Top Side Marking
Changed Active Current to 4mA
Typo Change QE pin to QE bit
Update Erase Suspend and Resume description.
Update Package Diagrams
UID Waveform Corrected
Change fR = 33Mhz
Added PDIP Package
Corrected Read Manufacturer / Device ID Fig 27.
Corrected Read JEDEC ID, Fig 29
Removed Preliminary designator
Updated package diagrams
Updated parameter VIL/VIH, tBP1, tSE
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
- 61 -
Publication Release Date: July 08, 2010
Revision E

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