NXP Semiconductors
MF0ICU1
MIFARE Ultralight contactless single-ticket IC
7. Chip orientation and bondpad locations
x (μm) y (μm)
Bump size
LA, LB, VSS
TESTIO
Chip Step
90
60
645(1)
90
60
665(1)
typ. 20.0 (1)
min. 5.0
241.7
125.5
typ. 20.0 (1)
min. 5.0
231.0
215.0
TESTIO
LA
VSS
LB
256.7
typ. 665.0 (1)
189.9
246.0
231.0
typ. 645.0 (1)
(1) The air gap between dies may vary due to foil expansion.
All dimensions in μm.
Pad locations measured from die center.
Fig 4. Chip orientation and bondpad locations
001aal531
MF0ICU1
Product data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.8 — 22 December 2010
028638
© NXP B.V. 2010. All rights reserved.
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